Domestic EDA technology pioneer | PFTN semiconductor

The development of power semiconductor products is a complex, multi-stage process requiring close collaboration among multiple teams. As the cornerstone of this process, the DTCO (Design-Technology Co-Optimization) flow achieves high-performance, cost-effective solutions and reduced time-to-market through the coordinated optimization of design and manufacturing.

During the data input stage, data sheets and packaging information serve as the foundation for circuit design. Parallel efforts in layout and process design are essential to ensure manufacturability. Failure analysis plays a critical role in identifying and resolving design issues, thereby enhancing product reliability.

The design and simulation phase is critical for optimizing product performance. By utilizing Mozz TCAD tools for process and device simulation, designers can predict how process parameters and device characteristics influence the final product. This enables early optimization in the design phase, thereby minimizing issues during subsequent manufacturing.

The device and modeling stage encompasses the development of physical and SPICE models, which serve as the foundation for circuit-level simulation and optimization, enabling detailed analysis and refinement.

The testing and manufacturing phases are critical for translating the design into a tangible product. During the testing phase, data is collected to assess the design’s performance, while the manufacturing process converts the design into physical components.

Effective information sharing is a critical component of the DTCO flow implementation. Design and manufacturing teams should collaborate by exchanging design data, process parameters, and test results in a timely manner to identify and address issues promptly through iterative collaboration.

Resource collaboration is also essential for successful DTCO execution. Design and manufacturing teams must collaborate to share resources such as design tools, testing equipment, and manufacturing assets, which can improve operational efficiency.

As semiconductor technology continues to advance, the DTCO process must evolve further to keep pace with emerging technologies and manufacturing processes. For instance, as device geometries continue to shrink, the complexity of both design and manufacturing escalates significantly. Consequently, the DTCO flow must incorporate advanced simulation tools, analytical methodologies, and cutting-edge manufacturing technologies to address these challenges effectively.

In conclusion, the DTCO flow is an integral component of semiconductor product development. Through design and manufacturing co-optimization, DTCO enables enhanced performance, cost reduction, and shortened development cycles. Implementing an effective DTCO process allows semiconductor manufacturers to strengthen competitiveness, address market needs, and foster sustainable growth.